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1151 ทำไมเงียบกันจังครับ
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กลัวจะกลายเป็นร้อนกระดอกแตกแทนน่ะสิครับ >_<Originally posted by โหงพราย View Postเห็นออกข่าวมาว่าดันบัสง่ายมากๆ หมูๆ ชิวๆ ลองเล่นๆบัส 200 ดูเลย แค่นี้ก็ 200x40 = 8.0GHz แล้ว หรือแบบฮาร์ตคอร์ ลอง 400x40 = 16.0GHz แรงนรกแตก งานนี้
ผมลังเลจะเปลี่ยนเหมือนกัน แต่สาเหตุหลักคือต้องการพอร์ต SATA 10 ช่อง = =''
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August 24
Next week, Intel is going to launch Core- and Pentium-branded "Skylake" desktop microprocessors for LGA1151 platform. Core i5 and i7 CPUs will be available on September 1st. Core i3s and Pentiums should be available on the same day in Asia, and at the end of September in other regions. Older reports alleged that the company will introduce 10 Core i3 and Pentium SKUs, but their specifications are largely unknown. We do have details on two models, Core i3-6100 and Pentium G4400, and those can be used to get a feel of what to expect from upcoming Core i3 and Pentium lineup.
Core i3-6100 will have 2 Hyper-Threaded cores and 4 MB of level 3 cache. The microprocessor will support AES and AVX2 instructions, and have the following technologies enabled: VT-x and VT-d virtualization, vPro, and Trusted Execution technology. The i3-6100 will integrate GT2 graphics, branded as HD 530. The GPU will run at 350 MHz, and will be clocked up to 1000 MHz.
Based on a list of planned Pentium models, the G4400 will be positioned as a successor to the G3250 Haswell-Refresh processor. The "Skylake" chip will have 2 CPU cores, 3 MB L3 cache, DDR3/DDR4 memory controller and GT1 GPU. The cores will be clocked at 3.3 GHz, and, combined with microarchitecture improvements, this should result in a few percent better CPU performance compared to the G3250. Like "Haswell Refresh" Pentium, the G4400 will not support AES and AVX/AVX2 instruction set extensions, and it is not going to support Hyper-Threading technology. The HD 510 GPU will operate at 350 MHz, and have the maximum frequency of 1050 MHz.
Both Pentium G4400 and Core i3-6100 CPUs will work with DDR3-1600 and DDR4-2133 memory, and will come with PCI-Express interface, supporting 3.0 specifications. The chips will have 65 Watt TDP.
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