AMD is planning to use HBM, or High Bandwidth Memory, with the water-cooled SKU. For those not familiar, HBM replaces the typical memory chips surrounding the GPU package with 3D-stacked DRAM dies that are all packaged under the same IHS alongside the GPU.
Current rumors suggest we?ll see 8GB of video memory, GCN 1.2 architecture, 4,096 stream processors, 256 TMUs, 128 ROPs and a 4,096-bit wide HBM interface that?ll result in a memory bandwidth of 640GB/sec.
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AMD CTO, Mark Papermaster claimed that AMD has been working on HBM for the last 7 years. In fact, AMD CEO Dr Lisa Su has confirmed that the next generation AMD flagship cards will be out by the end of this quarter (ie. by end of June) and they will sport HBM.
High Bandwidth Memory (HBM) was proposed as an industry standard back in 2010. HBM uses stacked DRAM memory in order to extract a higher memory bandwidth speed (higher than GDDR5) while keeping the power consumption under check. According to Papermaster, HBM offers a three-fold improvement in performance per watt compared to GDDR5, and a 50-percent increase in power savings.
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