Pin plating consists of 0.2 micrometers Au over 2.0 micrometer Ni (diffusion barrier between Au & the Cu pin).*
Pin diameter is 0.305 (+,-)0.025 mm.
Pin height is 2.030 (+,-)0.080 mm, seated in a solder (either 63/37 or 60/40 tin/lead) ball. http://www.intel.com/design/pentium4...s/24988703.pdf
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