Tweet
ข้าวหม้อเก่า เอามาต้มกินใหม่ กลับ OCZ Cryo-Z Phase Change
Product Details:
OCZ Technology's Cryo-Z is an advanced cooling solution for the extreme overclocker using phase-change technology to achieve sub-zero temperatures at the CPU. The built-in temperature monitoring and control circuitry keeps the temperature at a steady level of -45 to -50 degree Celsius at the nozzle. If the temperatures fall outside a predefined range, the system will automatically be shut down by the Cryo-Z control unit. The same control unit also pre-chills the system and automatically turns on the computer once a temperature of approximately -30 degree Celsius is reached. If the compressor and condensation units are reaching a critical high temperature threshold, the Cryo-Z will automatically initiate a shut-down sequence of the computer.
The Cryo-Z was developed with optimal user-friendliness in mind, including the insulation of the cooled parts as a necessary precaution against condensation. The novel approach to air-tight insulation using layered close-cell material greatly simplifies phase-change cooling to extreme temperatures by establishing an air-tight seal around the chilled structures. By preventing humidity from penetrating the insulation, icing-up can largely be avoided. Individual results will vary depending on climate conditions and user habits.
Now LGA 1156 & LGA 1366 Compatible ! !
*Note: The compatibility for LGA 1156 and LGA 1366 is available only at Performance-PCs.com and FrozenCPU.com. The Cryo-Z has been tested this additional hardware extensively and made it compatible to use it on the latest hardware!
A custom Intel mounting plate was manufactured that is adaptable for LGA 775, LGA 1156, LGA 1366 out of aluminum and powder coated it black. Then added to the kit was best backplate available for these sockets to complete the kit.
Features:
How does it work?
* The Cryo-Z uses a compressor to actively cool the nozzle mounted on your CPU in order to chill it down to sub-zero temperature. The Cryo-Z uses sophisticated internal control logic to prevent damage to your system caused by power outages or incorrect power-up sequences. *Before the system can be powered up, the Cryo-Z needs to pre-cool the head. Once the temperature at the CPU reaches -30 centigrade, the control logic allows power-up of the computer. If for some reason the temperature at the nozzle increases above 70 centigrade, the Cryo-Z will initiate the shutdown sequence of the computer to avoid damage from overheating. In order to achieve these capabilities, the connection between the power button of the system and the motherboard needs to be routed through the Cryo-Z, please follow carefully the installation instructions.
What precautions are taken against condensation and ice build-up?
* Condensation and ice build-up are some major concerns in any cryogenic environment. To reduce any exposure of cold surfaces to the ambient case air, every chilled surface of the Cryo-Z has been carefully insulated. In addition, a heating element is provided to be attached to the back of the motherboard, in order to prevent condensation behind the motherboard. Please consult the installation section of this manual
Product Details:
OCZ Technology's Cryo-Z is an advanced cooling solution for the extreme overclocker using phase-change technology to achieve sub-zero temperatures at the CPU. The built-in temperature monitoring and control circuitry keeps the temperature at a steady level of -45 to -50 degree Celsius at the nozzle. If the temperatures fall outside a predefined range, the system will automatically be shut down by the Cryo-Z control unit. The same control unit also pre-chills the system and automatically turns on the computer once a temperature of approximately -30 degree Celsius is reached. If the compressor and condensation units are reaching a critical high temperature threshold, the Cryo-Z will automatically initiate a shut-down sequence of the computer.
The Cryo-Z was developed with optimal user-friendliness in mind, including the insulation of the cooled parts as a necessary precaution against condensation. The novel approach to air-tight insulation using layered close-cell material greatly simplifies phase-change cooling to extreme temperatures by establishing an air-tight seal around the chilled structures. By preventing humidity from penetrating the insulation, icing-up can largely be avoided. Individual results will vary depending on climate conditions and user habits.
Now LGA 1156 & LGA 1366 Compatible ! !
*Note: The compatibility for LGA 1156 and LGA 1366 is available only at Performance-PCs.com and FrozenCPU.com. The Cryo-Z has been tested this additional hardware extensively and made it compatible to use it on the latest hardware!
A custom Intel mounting plate was manufactured that is adaptable for LGA 775, LGA 1156, LGA 1366 out of aluminum and powder coated it black. Then added to the kit was best backplate available for these sockets to complete the kit.
Features:
How does it work?
* The Cryo-Z uses a compressor to actively cool the nozzle mounted on your CPU in order to chill it down to sub-zero temperature. The Cryo-Z uses sophisticated internal control logic to prevent damage to your system caused by power outages or incorrect power-up sequences. *Before the system can be powered up, the Cryo-Z needs to pre-cool the head. Once the temperature at the CPU reaches -30 centigrade, the control logic allows power-up of the computer. If for some reason the temperature at the nozzle increases above 70 centigrade, the Cryo-Z will initiate the shutdown sequence of the computer to avoid damage from overheating. In order to achieve these capabilities, the connection between the power button of the system and the motherboard needs to be routed through the Cryo-Z, please follow carefully the installation instructions.
What precautions are taken against condensation and ice build-up?
* Condensation and ice build-up are some major concerns in any cryogenic environment. To reduce any exposure of cold surfaces to the ambient case air, every chilled surface of the Cryo-Z has been carefully insulated. In addition, a heating element is provided to be attached to the back of the motherboard, in order to prevent condensation behind the motherboard. Please consult the installation section of this manual
Comment