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Features and specifications of XPG Gaming Series v2.0 DRAM module:
All DRAM IC are verified by overclocking criteria.
Adopt aluminum heatsink with increased surface area to provide efficiency of offload heat away.
Adopt high quality 2oz copper 8 layers PCB to:
o Assist spreading of heat from critical areas to perform effective thermal cooling.
o Decrease the resistance of electronic flow to avoid electric waste
o Increase DRAM module's lifetime.
o Improve signal integrity
CAS Latency and recommended operating voltage:
o DDR3-2200G (9-9-9-24) 1.55V~1.75V
o DDR3-1866G (9-9-9-24) 1.55V~1.75V
o DDR3-1600G (9-9-9-24) 1.55V~1.75V
All XPG Gaming Series v2.0 DRAM module frequency are backward compatible.
Offer 2GB/4GB dual channel kit and 6GB triple channel kit (Q2/2010) options.
Optimized for 64-bit OS (operating system).
Limited lifetime Warranty.
All DRAM IC are verified by overclocking criteria.
Adopt aluminum heatsink with increased surface area to provide efficiency of offload heat away.
Adopt high quality 2oz copper 8 layers PCB to:
o Assist spreading of heat from critical areas to perform effective thermal cooling.
o Decrease the resistance of electronic flow to avoid electric waste
o Increase DRAM module's lifetime.
o Improve signal integrity
CAS Latency and recommended operating voltage:
o DDR3-2200G (9-9-9-24) 1.55V~1.75V
o DDR3-1866G (9-9-9-24) 1.55V~1.75V
o DDR3-1600G (9-9-9-24) 1.55V~1.75V
All XPG Gaming Series v2.0 DRAM module frequency are backward compatible.
Offer 2GB/4GB dual channel kit and 6GB triple channel kit (Q2/2010) options.
Optimized for 64-bit OS (operating system).
Limited lifetime Warranty.