Announcement

**Comlow** · 10 Aug 2020, 19:26:57

NEW Intel NUC 9 Pro “Quartz Canyon” Workstation Kit

Learn more about the new Intel NUC 9 Pro “Quartz Canyon” Workstation Kit, NUC9vXQN NUC9v7QN Subscribe now to Intel Business on YouTube: http://intel.ly/intelitcenteryt About Intel Business: Get all the IT info you need, right here. From data center to devices, the Intel® Business Center has the resources, guidance, and expert insights you need to get your IT projects done right. Connect with Intel Business: Visit Intel Business's WEBSITE: http://intel.ly/itcenter Follow Intel Business on TWITTER: https://twitter.com/IntelBusiness Follow Intel Business on LINKEDIN: https://www.linkedin.com/showcase/int... Follow Intel Business on FACEBOOK: https://www.facebook.com/IntelBusiness Intel® NUC 9 Pro: A Compact Workstation that Works As Hard As You | Intel Business https://www.youtube.com/channel/UC9G8...

**Comlow** · 11 Aug 2020, 09:38:27

Peking University's HPC for New Discoveries

Executive Summary
As a leading education and research institution in China, Peking University embraces many branches of learning in applied and pure sciences, social sciences, humanities, health and medicine, business, and education. Important to its research support is the university’s High Performance Computing (HPC) facility. Peking University’s HPC resources help scientists make new discoveries in materials, physics, chemistry, weather and climate, and many other disciplines. Its latest additions to the HPC facility include two clusters for teaching and student research based on Intel® Xeon® Scalable processors and Intel® Omni-Path Architecture (Intel® OPA) fabric.

Challenge
HPC facilities are an important component to academic research. To maintain its reputation as a leading research institution in China, Peking University needed greater computing capability in its HPC facilities to support ongoing research in chemistry, image processing, artificial intelligence (AI), cryo-electromagnetism (cryo-EM), and other sciences.

Solution
In 2018, Peking University turned to supercomputing vendors for new supercomputing clusters. In May, the university put into production a four-node teaching cluster for education. This system was built with Inspur NF5280M5 servers using Intel® Xeon® Gold 6132 processors with 14 cores each. The total cluster provides 112 cores, which are used to create many virtual machines across the system.

Later that year in October, a much larger research cluster called Weiming Life Science #1 was put into production with 150 total nodes. 129 compute nodes of Lenovo SD530 servers each house two Intel® Xeon® Gold 6142 processors with 16 cores, and seven Lenovo XS1500 GPU nodes each include two Intel® Xeon® E5-2690 v4 processors and four graphics cards. An additional 14 nodes of Lenovo SR650, SR630, and Lenovo System X3650 M5 servers provide login, management, and storage services. The compute and GPU nodes are interconnected by 100 Gbps Intel Omni-Path Architecture (Intel OPA).

The research cluster delivers a total of over one-half petaFLOPS of peak performance (587.8 teraFLOPS).

Peking University’s HPC resources help scientists make new discoveries in materials, physics, chemistry, weather and climate, and more.

Results
“The new clusters provide the high-performance scientific and engineering computing services needed across the entire university,” commented Mr. Chun Fan, Senior Engineer, Chief of the System Management Section in Computing Center Peking University and Chief Engineer in HPC platform of Peking University. “These systems meet the needs of large-scale data processing and scientific computing required by research in cryo-EM, deep learning, biomedical, physics, and other sciences.”

Many projects have already taken advantage of the computing capabilities of Weiming Life Science #1, such as the following:

Computational support and visualization of cryo-EM research on Eukaryotic cell structure and interaction with human proteasome. (Cryo-EM Structures and Dynamics of Substrate-Engaged Human 26S Proteasome)
Creation of an objective method of Surveillance Video Quality Assessment (SVQA) of images from surveillance data. (How to Assess the Quality of Compressed Surveillance Videos using Face Recognition)
STEM and Ab initio simulation of methylammonium lead iodide perovskite research for next-generation solar cell development. (Atomic scale insights into structure instability and decomposition pathway of methylammonium lead iodide perovskite)

These and many other reports are available on the Peking University HPC’s web site.

Solution Summary

Intel Xeon Gold and Intel® Xeon® Silver processors
150-node Weiming Life Science Cluster #1 built by Lenovo
Intel Omni-Path Architecture fabric
587.8 teraFLOPS peak performance

**Comlow** · 11 Aug 2020, 10:12:31

This year we have SEVEN talks
@hotchipsorg
, including a
@Rajaontheedge
keynote Monday Aug 17th!
https://intel.ly/2DVq2lx
Don’t miss additional talks from Intel leaders on:
• Tiger Lake SoC Architecture
• Xe GPU Architecture
• Next-Gen Xeon Scalable Processors
• Agilex FPGAs

**Comlow** · 13 Aug 2020, 17:03:53

Intel Q3 2020 Vitual Event for Investor Calender

**Comlow** · 13 Aug 2020, 18:53:18

Tigerlake SoC The First Intel's " SUPER FIN TRANSISTOR " Deployed.

Intel Tiger Lake features SuperFin

We have more details on Intel’s upcoming Tiger Lake architecture. The series will be announced on September 2nd during a special virtual event. In the meantime, we have gathered new information from our sources.

Intel has set a number of goals for its next mobile series, including: greater CPU and GPU performance, scalability for different workloads, increased memory and fabric efficiency, advances in security, and more.

All this combined is to expected deliver a significant upgrade to the 10nm mobile series.
SuperFin and SuperMIM

The most significant improvement, however, is hidden in a fabrication node itself. Intel is calling it the 10nm SuperFin architecture because it features a redesigned transistor (SuperFin) and capacitor design (Super MIM). According to people familiar with the matter, this intranode architecture will provide a performance uplift comparable to a full-node transition. A redefined FinFET will provide additional gate pitch (higher drive current), improved gate process (higher channel mobility), and enhanced expiation source/drain (lower resistance). Additionally, 10nm SuperFin architecture will benefit from the introduction of Super MIM capacitor, delivering 5x the increase in MIM (metal-insulator-metal) capacitance.

The company is developing a 10nm Enhanced SuperFin architecture, promising additional performance, interconnect innovations, and optimization for data centers.

Intel SuperFin transistor and Super MIM capacitor (left), Source: Raja Koduri

Willow Cove core architecture

Intel Tiger Lake will also benefit from core architecture upgrade to Willow Cove, which was built upon Sunny Cove design (Ice Lake). It features a redesigned middle-level cache of 1.25MB, as we already seen in the leaks. It also features Control-Flow Enforcement technology to increase security against return/jump oriented attacks.

More importantly, Intel confirmed that Tiger Lake will feature ‘dramatic frequency increase over prior generation’. The Willow Cove core will deliver higher frequency at lower voltages than Sunny Cove.
Intel Xe-LP Graphics

Tiger Lake’s integrated graphics were built upon next-generation Xe graphics architecture. The Tiger Lake SoC features up to 96 Execution Units, compared to last-gen’s maximum of 64. The GPU chip features 3.8MB of L3 cache.

Memory and bandwidth

It is said that Tiger Lake was designed for high bandwidth, which required further innovations in fabric and memory throughput within the silicon. The coherent fabric (ring) bandwidth was doubled compared to Ice Lake. The memory subsystem now supports up to 86GB/s of bandwidth with architectural support for
LP4x-4267, DDR4-3200 and LP5-5400.

Display, GNA 2.0 and IO

The Xe-LP architecture display engine supports more displays connected to the SoC at higher resolutions and quality. It can handle videos up to 4K30 initially with plans for up to 4K90 support and images up to 42 Megapixels with initial 27 MP support.

Intel Tiger Lake also features Gaussian and Neural Accelerator 2.0 for various AI operations such as high dynamic range noise cancellation.

As promised, Intel Tiger Lake supports Thunderbolt 4 and USB4. Each port has a bandwidth of up to 40 Gb/s. The USB Type-C will support Displayport alternative mode, DP tunneling over Thunderbolt, and DP-in ports for discrete graphics card display output to mux over the C port. Tiger Lake is Intel’s first architecture to support PCIe 4.0.

**Comlow** · 13 Aug 2020, 22:36:47

Welcome to Intel Architect Day 2020 Live Stream

TO BE CONTINUE CLICK THE LINK BELOW

https://player.vimeo.com/video/447304765

10nm SuperFin technology combines Intel's enhanced FinFET transistors with a Super MIM capacitor and an improved interconnect metal stack to deliver performance improvements comparable to a full-node transition, representing the largest single, intranode enhancement in Intel’s history. At Architecture Day in August 2020, Intel Chief Architect Raja Koduri, Intel fellows and architects provided details on the progress Intel is making.
(Credit: Intel Corporation)

**Comlow** · 14 Aug 2020, 08:13:27

**ssk** · 15 Aug 2020, 06:57:52

Happy Birthday to the PC: Either the Best or Worst Thing to Happen to Computing

สุขสันวันเกิด PC 39 ปีแล้วนะ
https://www.extremetech.com/computin...n-to-computing

By Joel Hruska on August 12, 2020 at 4:15 pm

Thirty-nine years ago today, IBM launched the IBM Personal Computer (model number 5150). This was, depending on your point of view, either a calamity or a cause for celebration.

PC ที่เราใช้ๆกันนี้ ถือกำเหนิดมา 39 ปีแล้วนะ โดย IBM เป็นผู้สร้างมันขึ้นมา

The machine itself wasn’t particularly powerful by the standards of the day. When Intel offered IBM the 8086 (a 16-bit CPU with a 16-bit external bus) IBM requested a cost-optimized version of the chip instead. The result was the 8088, which ran at the same 4.76MHz clock as the 8086 but only had an 8-bit bus to external memory. Here’s the original motherboard:

ในยุคแรกๆนั้น มันไม่ได้มีพลังอะไรนักหนาหรอกครับ เมื่อ INTEL เสนอ 8086 ให้ IBM ได้ขอให้เอาตัวที่มันไม่แพงนัก ซึ่งก็คือ 8088 < PC XT และ บัดกรีหน่วยควมจำติดบอร์ดมาเลย

AMD made the memory chips in the lower-right-hand block. All four banks had to be filled at all times, but once they were, additional RAM could be installed. This motherboard mounts 512KB of RAM in the expansion banks and 64KB in its separate slots, for a total of 576KB of RAM. Hot stuff. Image by German via Wikipedia, CC BY-SA 3.0.

จากรูป มุมขวา AMD ทำ หน่วยเก็บข้อมูล ตรงมุมขวาล่าง มี 4 แถว 512 KB เสียบเพิ่มได้อีก 64 KB แค่นั้นแหละ

I’ve outlined the Intel 8088 in the upper left-hand corner. Those are ISA slots on the left (8-bit, half-duplex, and you could literally make your internet connection faster if you overclocked them by the late 1990s). The large bank of chips in the mid-to-lower right are RAM.

INTEL 8088 อยู่มุมขวาบน เหนือ Slot 8 BITS ISA และตัวใหญ่ๆ ตรงกลางล่าง นั่น RAM แล้ว IBM PC เปลี่ยนทุกอย่างยังไงล่ะ

How the IBM PC Changed Everything
The long-term impact of the IBM PC was nothing short of seismic. AMD exists today in its present form because IBM demanded a guaranteed second-source manufacturer for Intel CPUs, which meant Intel had to grant AMD a license to manufacture x86 products. While AMD is not the only company to hold an x86 license, it’s in a rare club — apart from Intel, only VIA and its subsidiary Zhaoxin manufacture their own modern x86 designs.

ผลกระทบมันเป็นเรื่องระยะยาว ที่ AMD ยังอยู่ทุกวันนี้ก็เพราะ IBM ให้การยืนยันความต้องการให้มี ผู้ผลิต CPU รายอื่นนอกจาก INTEL ในตลาด PC เป็นทางเลือก
ซึ่งทำให้ INTEL ขาย LICENCE X86 ให้ AMD CYRIX < วันนี้คือ VIA ตลาด PC ถึง ขยายตัวนับแต่นั้น

But part of the reason why we talk about AMD and Intel today as opposed to Motorola versus MOS Technologies is that the IBM PC drove a wave of industry consolidation, which killed a number of companies. Companies such as Commodore and Amiga had their own visions of computing and computer architectures. There were specific points in time where other manufacturers introduced systems with hardware capabilities more advanced than those available in the IBM PC 5150 (not a high bar to clear) or the clone machines that eventually came to market. I still believe that one of the differences between PC gamers who grew up in the 80s versus PC gamers who grew up over the past 20 years is that we older players remember a time when PCs were, in fact, downright lousy in the sound and graphics department.

ซึ่งการที่เราพูดถึงเรื่อง INTEL VS AMD ในปัจจุบัน สมัยนั้นเค้าจะคุยเรื่อง MOTOLORA VS MOS และ MOTOLORA VS INTEL ในยุคต่อมา PC ที่ IBM ผลักออกมาได้ กำจัด หลายๆ บ.ออกไป อย่าง commodore Amiga ซึ่งมีระบบของมันเอง MAC clone ตัวแรกก็ยี่ห้อนี้ หรือรายอื่นๆที่ออกสินค้าที่ก้าวหน้ากว่า IBM PC 5150 ก็ตาม ซึ่ง นักเล่นเกม PC หลายๆคนที่เติบโตในช่วงยุค 80 หรือเกินกว่า 20 ปีที่ผ่านมาน่าจะเคยเห็นและจำมันได้

This wasn’t just true when compared with the NES. Machines like the Commodore 64, Atari ST, and the Amiga 500 all had features that were difficult or impossible to buy on competitive PCs of their eras. In the long run, that didn’t matter. The IBM PC rose, and the various competitors fell. In the same way that AMD is the only alternate x86 manufacturer left with any significant market share, Apple is the only alternate PC manufacturer left in a space that once included companies like Xerox, Commodore, Atari, NEC, AT&T, and Amiga, to name a few. (NEC is still an OEM but I’m referring specifically to companies that built on a non-x86 / IBM framework).

และมันไม่ใช้สิงที่แค่เป็นจริง เมื่อเทียบกับ NES Commodore 64 Atari ST Amiga500 ทั้งหมดนั้นมีลูกเล่น ที่หาได้ยากบน หรือไม่มีบน PC ในยุคนั้น แต่ในการต่อสู้ระยะยาว IBM PC นั้นขยายตัว และ ผู้แข่งขันหลายๆคน ล้มหายไป ในทางเดียวกัน AMD ยังอยู่ได้ ด้วยส่วนแบ่งการตลาดที่ดี Apple เป็นเพียงผู้อยู่รอดรายเดียวจากยุคนั้น ที่อยู่ในที่ของตัวเองXerox, Commodore, Atari, NEC, AT&T, and Amiga, to name a few พวกนี้คนไม่รู้จักกันแล้ว

One of the hallmarks of the information age has been the way it consistently produces economic conditions that favor monopolies or near-monopolies in various markets. It’s going to be incredibly interesting to watch Apple’s ARM transition, if only because you have to go back nearly two decades to find an era when there were two personal computing-centric CPU architectures on the market that could be called competitors.

สิ่งที่เกิดขึ้นมันทำให้เกิดสภาวะผูกขาด หรือ เกือบผูดขาดโดย X86 CPU มันจึงน่าสนใจมากที่ apple ประกาศไปใช้ ARM CPU ซึ่งจะกลับมาสู่โลกที่มีผู้พัฒนามากกว่า 1 ค่ายเหมือนยุคนั้น

At the time, many computer industry watchers were hoping that the personal computer would break IBM’s hold on the industry, not that the company would go on to dominate it. In a way, their wish came true — just not in the form they necessarily wanted. IBM’s lock on the market was decisively broken. It exited the PC business decades ago and its mainframe computer market share is a small percentage of the total enterprise computing space. But IBM’s platform decisions shaped the future of everything to come. Had Big Blue chosen to work with Motorola instead of Intel, we’d probably be talking about the WinMo alliance and how it transformed the market.

ในยุคนั้น บ.คอมพิวเตอร์หลายๆค่าย อยากจะหยุด IBM ไว้แบบที่เรากระทืบ INKAK กันนี่แหละ แต่ไม่มีไครทำได้กัน แต่สิ่งที่ผิดพลาดเกิดจากการที่ IBM ไม่ได้ล๊อคตลาดไว้กับตัวเอง การตัดสินใจที่ผิดพลาดทำให้มันพังทลาย IBM ออกจากตลาด PC < ขายให้ Lenovo เหลือที่ยืนไนตลาด Mainframe และ HPC แต่ PC ที่ IBM ให้กำเหนิดนี้เป็นผู้สร้างอณาคตอย่างแท้จริง และอยู่บนโต๊ะ อยู่ในกระเป๋าเราทุกคน ที่ใช้ computer ถ้าวันนั้น IBMเลือ MOTOLORA แทน INTEL เราคงได้ใช้ WINMO Windows กับ MOTOLORA CPU กัน < MOTOLORA RISC ที่ไปช่วย IBM ทำ POWER PC นี่คือสิ่งที่ผมผ่านยุคสมัยมาน่ะครับ เอามาเล่าให้ฟัง

Top image credit: Ruben de Rijcke / CC BY 3.0

HAPPY BIRTHDAY ย้อนหลัง คุณ IBM-PC
รัวสรรค์ SUB ไม่ค่อยนรก BY SSK

**Comlow** · 15 Aug 2020, 21:52:17

Intel AI-Powered Virtual Assistant Mobilized to Assist Reopening of Military Museum

A Canadian museum is safely reopening from its pandemic closure with the help of a virtual assistant powered by artificial intelligence (AI). Originally designed by CloudConstable to welcome visitors to the Ontario Regiment Museum, virtual assistant Master Cpl. Lana interacts with visitors over a large screen, and was reconfigured with Intel® RealSense™ and AI technology to enable the safe return of the many volunteers who keep the museum and vehicles operating.

The Ontario Regiment Museum houses North America’s largest collection of operational military vehicles, many dating back to the 1940s. The collection allows the public to experience a piece of history, both at the museum and through the historical films in which the vehicles often appear.

At the start of the pandemic in early 2020, CloudConstable began working with the museum to design Master Cpl. Lana as an AI virtual assistant who would greet visitors, check them in and provide museum details.

Before Lana’s deployment, COVID-19 closed the museum to the public. But with over 120 military vehicles that need constant servicing and driving, the museum needed its volunteers to continue their essential maintenance and operations work at the site.

A volunteer interacts with AI virtual assistant Lana at the Ontario Regiment Museum. The Canadian museum is safely reopening from its pandemic closure with the help of the virtual assistant powered by Intel's artificial intelligence technology and RealSense cameras. (Credit: MCW Media and Photography)

» Download all images (ZIP, 44 MB)

“The Ontario Regiment Museum is one of the few museums in the world with such a large and diverse collection of operating military vehicles, which help people experience history in a very real way. Regular maintenance is crucial, even during the worst of the pandemic, which is why we turned to CloudConstable and Intel to help build an autonomous solution,” said Jeremy Blowers, executive director of the Ontario Regiment Museum.

CloudConstable relied on the Intel RealSense team’s insight that Lana’s existing and unique capabilities — already built on the Intel RealSense Depth Camera and using the Intel® Distribution of OpenVINO™ toolkit for accelerated machine vision inferences — could be extended for a more comprehensive and safer COVID-19 screening solution. Adding an Intel® NUC 9 Pro with Intel Active Management Technology, as part of the Intel vPro® platform, the team reworked Lana to take temperatures via thermal scans and ask a series of questions to assess COVID-19 risk and exposure. Since June, Lana has provided an enhanced, fully automated and touchless screening process so volunteers can continue to do their important work with the vehicles.

“Intel RealSense technology is used to develop products that enrich people’s lives by enabling machines and devices to perceive the world in 3D. CloudConstable leverages Intel’s technology to help create a state-of-the-art natural voice and vision interface with touchless, self-service COVID-19 screening,” said Joel Hagberg, head of product management and marketing for Intel’s RealSense Group.

With the Ontario Regiment Museum now preparing to reopen to the public, CloudConstable, along with Intel, is working to bring the new COVID-19 protection capabilities into the original concept for Lana as a greeter for visitors. Lana will greet visitors, provide contactless check-in, scan temperatures and ensure the museum adheres to visitor limits and other COVID-19 health protection protocols. Eventually, she’ll even thank them for coming and help visitors keep in touch with all the latest activities at the museum.

More Context: Meet the AI Museum Guide Who Can Screen for COVID-19 (Blog) | Meeting the Challenge of COVID-19 | Intel’s Vision Product Portfolio

Intel Customer Stories: Artificial Intelligence Support for an Unexpected Essential Business | Intel Customer Spotlight on Intel.com | Customer Stories on Intel Newsroom

Tags: Canada News, Customer Stories, Ontario Regiment Museum, Realsense

**Comlow** · 17 Aug 2020, 17:54:44

SuperFin Technology: Advancing Process Performance | Intel Technology

We’ve taken the FinFET and given it some major upgrades. Intel SuperFin technology innovates from the transistor channel all the way up to the metal interconnect stack, driving dramatic performance improvements for products in 2020 and beyond.

Learn more about SuperFin and other technology innovations from Intel: https://newsroom.intel.com/architectu...
Subscribe now to Intel Technology on YouTube: https://bit.ly/3gMyNNA
Connect with Intel Technology: Visit Intel Technology WEBSITE: https://intel.ly/2Zuwo2K
Follow Intel Technology on TWITTER: https://twitter.com/Inteltech SuperFin Technology:
Advancing Process Performance | Intel Technology https://www.youtube.com/channel/UC_9t...

**Comlow** · 17 Aug 2020, 18:00:06

Tiger Lake SoC Architecture Explainer | Intel Technology

Meet Intel’s next generation mobile client processor. Tiger Lake leverages the new SuperFin technology,
a combination of new transistor technologies as well as an improved metal stack, for increasing current, lowering voltages and helping ensure a solid power delivery response.

The Willow Cove CPU core builds upon Sunny Cove with redesigned caching architecture and Control Flow Enforcement for better security while delivering dramatic frequency increases over the prior generation.

The Xe GPU brings massive graphics performance per watt efficiency with increased AI capabilities.

New IP technologies like PCIe Gen 4, GNA 2.0, Thunderbolt 4, USB 4, IPU6, bring additional functionality for a greater user experience. Learn more about Tiger Lake and the technology innovations that made it possible: https://newsroom.intel.com/architectu... Subscribe now to Intel Technology on YouTube: https://bit.ly/3gMyNNA Connect with Intel Technology: Visit Intel Technology WEBSITE: https://intel.ly/2Zuwo2K Follow Intel Technology on TWITTER: https://twitter.com/Inteltech Tiger Lake SoC Architecture Explainer | Intel Technology https://www.youtube.com/channel/UC_9t...

**Comlow** · 17 Aug 2020, 18:15:07

Media Alert: Intel At Hot Chips 2020

Join Intel at Hot Chips, a conference on high-performance microprocessors and related integrated circuits, where Raja Koduri, senior vice president, chief architect and general manager of Architecture, Graphics and Software, will deliver a keynote presentation explaining the opportunities for hardware-software co-design. Together with partners and customers, Intel is building the trusted foundation for computing in a data-centric world.

Hot Chips 2020

When: Sunday, Aug. 16 — Tuesday, Aug 18, 2020

Where: Virtual Event

Registration

Keynote: No Transistor Left Behind

Raja Koduri

When: Monday, Aug. 17, 2-3 p.m.

While silicon technology scaled exponentially over the past few decades, the breadth and depth of the software stack scaled at a much faster rate than could have been predicted by Moore’s Law, bringing inefficiencies and leaving plenty of room for increasing performance. In this keynote, Raja Koduri will explore opportunities in hardware-software co-design from the edge to the cloud to fully leverage the transistors that are left behind by the incredible pace of software change at the top of the stack.

Towards a Large-Scale Quantum Computer Using Silicon Spin Qubits

James S. Clarke

When: Sunday, Aug. 16, 3:45-5:15 p.m.

James S. Clarke, director of quantum hardware at Intel, will present progress toward the realization of a 300mm Si-MOS based spin qubit device in a production environment. In addition, this talk will focus on a key bottleneck to moving beyond today’s few-qubit devices: the interconnect scheme and control of a large quantum circuit. To address this bottleneck, at Intel we have developed customized control chips, optimized for performance at low temperature, with a goal of simplifying wiring of quantum systems and replacing the racks and racks of discrete electrical components.

Next-Generation Intel Xeon Scalable Server Processor: Icelake-SP

Irma Esmer Papazian

When: Monday, Aug. 17, 9:30-11:30 a.m.

Irma Esmer Papazian, senior principal engineer in architecture at Intel, will present on the next generation Intel® Xeon^TM processor (code named “Icelake-SP”), a general-purpose server processor designed to bring significant performance boost over prior-generation Xeon processors. Icelake-SP is the first Xeon server implemented on Intel 10nm processor technology and is targeted for the end of 2020. Irma will describe new enhancements to Icelake-SP, including ISA, security technologies and core microarchitecture improvements, diving into their use and impact in server application. She will also highlight key features, microarchitecture insights and performance trends of Icelake-SP not shared previously.

Inside Tiger Lake: Intel’s Next Generation Mobile Client CPU

Xavier Vera

When: Monday, Aug. 17, 12-1 p.m.

Xavier Vera, principal engineer and SoC/performance power architect at Intel, will lead a discussion on Tiger Lake, Intel’s next generation mobile client CPU. Tiger Lake provides the best performance and battery life Intel has ever offered for mobile content creation, productivity and gaming usages. The new high-performance core in Tiger Lake is called Willow Cove, which adds enhanced security features to help protect against return-oriented programming attacks along with increases in performance via frequency push and L2 cache size increases. Intel® Xe-LP is the new graphics engine within Tiger Lake that increases the maximum number of execution units from 64 to 96. Xavier will cover how Tiger Lake was able to achieve significant gains in performance and drive competitive battery life.

The Xe GPU Architecture

David Blythe

When: Monday, Aug. 17, 5-6:30 p.m.

David Blythe, Intel senior fellow and director of Graphics Architecture, will discuss Xe, Intel’s next-generation GPU architecture. Xe was designed for scalability – spanning teraflop to petaflop compute performance – and is slated for use in multiple Intel products including Tiger Lake Client SoC and HPC GPU Ponte Vecchio. In this presentation, he will explain the principles behind Xe configurability and scalability and its many efficiency enhancements, as well as new capabilities, including hardware acceleration support for ray tracing, matrix/tensor processing and multidie/multipackage connectivity. Blythe will then delve into details for one configuration of the architecture, Xe-LP, employed in lower TDP product segments.

Agilex Generation of Intel FPGAs

Ilya Ganusov and Mahesh A. Iyer

When: Tuesday, Aug. 18, 8:30-10 a.m.

Ilya Ganusov, senior principal engineer and director of Programmable Architecture at Intel, and Mahesh A. Iyer, Intel fellow in the Data Platforms Group and chief architect and technologist of Electronic Design Automation, will provide an in-depth technical disclosure of Intel’s next-generation Agilex™ FPGA platform. Agilex™ FPGAs deliver over 40% higher peak performance and use 40% less power, on average, over prior generation Stratix®10 FPGAs. Details on volume production shipment on engineering samples of Agilex™ FPGAs will be revealed in the presentation.

Tofino2 — A 12.9Tbps Programmable Ethernet Switch

Anurag Agrawal and Changhoon Kim

When: Tuesday, Aug. 18, 10:30 a.m.-12:30 p.m.

In this presentation, Anurag Agrawal, senior principal engineer in the Barefoot Division of the Data Center Group, and Changhoon Kim, Intel fellow in the Connectivity Group and chief technical officer of applications in the Barefoot Switch Division, will describe Tofino2, a 12.9Tbps fully-programmable switch silicon that is an evolution of the original Tofino architecture in both speed and capability. Enhancements to Tofino2 include an increase in fungible resources and the addition of several novel primitives to help users realize new types of networking protocols and functions, such as advanced telemetry, advanced congestion control and flexible scheduling.

Contact: Bruce Fienberg
(510) 220-6461
Bruce.Fienberg@intel.com

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.

Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

Statements in this document that refer to future plans or expectations are forward-looking statements. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.

Tags: Hot Chips 2020

**Comlow** · 17 Aug 2020, 18:19:11

This is AI on Intel.

Artificial Intelligence has unleashed a new era of creativity and ingenuity. Today, Intel® technologies power some of the most promising AI use cases in business, society, and research. From massive cloud to tiny device, Intel turns the promise of a transformative AI model into a global-scale reality.

Our customers have achieved success across a range of hardware: massive inference deployment on CPUs across multiple data centers for content recommendation engines, VPU-based cameras that protect endangered species from poachers in real-time, and FPGAs that provide acceleration for fast search results. Intel® hardware and software power image recognition, cyber intelligence, predictive maintenance, fraud waste, and much more. From data strategy to enterprise-scale deployment, Intel and our ecosystem accelerate time from pilot to business impact with production-ready solutions that solve common problems—no matter what your industry.

And there’s more to come. We’re working closely with the AI community to accelerate discoveries and make meaningful progress in how we use artificial intelligence to add value to our work and lives, whether it’s finding water on the moon, speeding critical medical diagnoses, or seeing product defects faster. This is AI on Intel.

**Comlow** · 18 Aug 2020, 08:05:17

(Credit :: Dr. Ian Cutress @Anandtech for pictures)

สิ้นสุดการรอคอย Sunny Cove SP Microarchitect กับการเปิดเผยข้อมูลสถาปัตยกรรมภายในครั้งแรก วันนี้ฟินมากๆ ครับ แม้ตัว Icelake SP ที่นำมาโชว์จะยังเป็นรุ่นกลางๆ
และเป็นระดับ Engineering Sample ก็ถือว่าแจ่มมาก เมื่อเทียบกับข้อมูลของ Skylake SP เดิมที่พี่น้องหลายๆ ท่านคุ้นเคย และอย่างที่ได้เคยเล่าให้หลายๆ ท่านฟังแล้วในเรื่อง
ปัญหาการประมวลผลคำสั่ง AVX512 ที่ได้รับการแก้ไขมาตั้งแต่ Icelake U/Y ในระดับ Mobile ขณะนี้ CPU ในระดับ Server Workstation และ HEDT กำลังจะได้สัมผัสพลังที่แท้
จริงของ Sunny Cove Microarchitect ระดับสุดยอดกับ Icelake SP กันในเร็วๆ นี้ กำหนดเปิดตัวประมาณ 23 ตุลาคม 2563 ครับ

(

Special T-Shirt from Uncle Raja Kudori Thank you very much

)

เทียบข้อมูลกับ Skylake X ครั้งเปิดตัวในปี 2017 พี่น้องคอความแรงสาย Intel จะเห็นอะไรที่สุดยอดมากๆ ครับ

Sunny Cove SP Microarchitect VS Skylake SP Microarchitect below

รอซื้ออย่างเดียวสำหรับคอความแรงสาย Intel

**Comlow** · 18 Aug 2020, 08:31:37

Intel 11th Generation Mobile Core Processor (Codename Tigerlake) มีกำหนดเปิดตัวอย่างเป็นทางการวันที่ 2 กันยายน 2563 ทั่วโลก
สินค้าน่าจะเริ่มมีจำหน่ายในช่วงต้นเดือนตุลาคม 2563 เป็นต้นไป ท่านที่สนใจสามารถติดตามผลิตภัณฑ์จากแบรนด์พันธมิตรของ Intel ทุกค่ายครับ

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Intel Technology News & Update (ไว้ให้ทุกท่านมาลงข่าวเกี่ยวกับ Technology ของ Intel)

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